1.7.2 Bay SystemPRODUCTS
| Large LCD,HD | | | Controversial Points | • Isolated by the partition between process area Class 1) and maintenance area (Class 1000). Class→Particles/ft3 • Wafer is exposed in the air of cleanroom. • Filter coverage for the total ceiling area is about 30% |  | | Attention Points | • Establishment of the technique for chemical contamination control inside room (Concentration in air and on wafer). • Parallelism of air flow pattern at process area. • Keeping pressure difference between process/maintenance area. | | | | | | | | |
1.7.3 Ballroom System PRODUCTS
| LSI, Organic EL, Small LCD | | | Controversial Points | • Cleanliness in Ballroom about Class 1000. • Wafers are transported by Pod. • Energy consumption for keeping cleanliness is 1/3 as compared to Bay System CR • Flexibility for the layout change of process Tool |  | | Attention Points | • Measures of chemical contamination control and criteria. • Room temperature control. • Keeping clean environment during maintenance of Tool. | | | | |
1.7.4 Mini-Environment System | Inconsistency of Air Flow for Mini-Environment System | Double Equipped by Mini-Environment System and Cleanroom System |  |  | | Low Class Clean Air Inflow to High Class Clean Area | Increment of Process Tool integrated with FFU |
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